In this episode, our guest Joe Dickson, tells us about the cutting-edge technology implemented in advanced packaging at Wus Printed Circuit International.
0:00 Intro
00:59 Wus
04:13 Pre-packaged Chips
07:49 Reliability and Signal Integrity Challenges
15:07 Design Flexibility
17:10 Speed is Everything!
21:34 Integral Simulation
27:12 Faraday Cages with Surface Cable Connections
36:58 The Market & the PCIe Method
39:38 Mainstream Silicon Photonics
44:17 Standardization Versus Innovation
48:10 The Future of PCB Assembly is Hybrid
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